| Processor |
|---|
| Processor generation | AMD Ryzen 8000 Series |
| Processor base frequency | 4.1 GHz |
| Processor manufacturer | AMD |
| Cooler included | No |
| Configurable TDP-down | 45 W |
| Thermal Design Power (TDP) | 65 W |
| Processor cache | 16 MB |
| Processor model | 8700F |
| Processor threads | 16 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 5 GHz |
| Processor lithography | 4 nm |
| Processor family | AMD Ryzen™ 7 |
| Processor cores | 8 |
| Box | No |
| Processor socket | Socket AM5 |
| Configurable TDP-up | 65 W |
| Processor cache type | L3 |
| Neural processor unit (NPU) |
|---|
| Neural processor unit (NPU) | AMD Ryzen AI |
| NPU performance up to | 16 TOPs |
| Memory |
|---|
| Memory types supported by processor | DDR5-SDRAM |
| Memory clock speeds supported by processor | 3600,5200 MHz |
| Memory channels | Dual-channel |
| Graphics |
|---|
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power |
|---|
| Configurable TDP-down | 45 W |
| Thermal Design Power (TDP) | 65 W |
| Technical details |
|---|
| PCI Express slots version | 4.0 |
| Supported instruction sets | AES, AVX, AVX 2.0, AVX-512, MMX, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSSE3 |
| Compatible operating systems | Windows 11/10 x64, RHEL x86 64-bit, Ubuntu x86 64-bit |
| Thermal Design Power (TDP) | 65 W |
| Market segment | Desktop |
| Configurable TDP-up | 65 W |
| Processor cache type | L3 |
| Features |
|---|
| Maximum number of PCI Express lanes | 20 |
| Thermal Design Power (TDP) | 65 W |
| PCI Express slots version | 4.0 |
| Supported instruction sets | AES, AVX, AVX 2.0, AVX-512, MMX, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSSE3 |
| Compatible operating systems | Windows 11/10 x64, RHEL x86 64-bit, Ubuntu x86 64-bit |
| Market segment | Desktop |
| I/O configuration |
|---|
| USB ports quantity | 5 |
| Processor special features |
|---|
| Configurable TDP-up | 65 W |
