Team Group T-FORCE G50 512 GB M.2 PCI Express 4.0 NVMe 3D NAND

SKU
TM8FFE512G0C129
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In Stock: 36 available
512GB, M.2 2280, PCIe Gen4x4, NVMe, 325 TBW. 3.3V, Black
  • A new choice for gaming upgrade
  • Preset controller solutions
  • Different caching grading systems offered to cover users’ needs
  • Ultra-thin patented graphene heat-sink makes installations painless
  • Optimized performance operation that balances reliability and lifetime
  • Smart product status monitoring system
  • An environmental protector
  • Patented graphene heatsink
  • US invention patent (certificate no.: US11051392B2)
  • Taiwan invention patent (certificate no.: I703921)
  • China utility patent (certificate no.: CN 211019739 U)
  • S.M.A.R.T. software patent
  • Taiwan invention patent (No.: I751753)
More Information
SKU TM8FFE512G0C129
EAN 4711430801728
Manufacturer Team Group
Availability Yes
Product Family T-FORCE
A new choice for gaming upgrade
T-FORCE G50 Pro / G50 PCIe4.0 SSD adopt PCIe Gen4x4 interface. Having read and write speeds reaching 5000 MB/s, the SSDs allow users to enjoy gaming on a new level with easy upgrades and storage capacity increase.

Preset controller solutions
T-FORCE G50 Pro / G50 PCIe4.0 SSD use InnoGrit controller solutions by default, allowing users a peace of mind in their usage experience.

Different caching grading systems offered to cover users' needs
The SSDs come with different grading systems to suit different needs: T-FORCE G50 Pro PCIe4.0 SSD supports DRAM Caching and SLC Caching, whereas T-FORCE G50 PCIe4.0 SSD only supports SLC Caching. Choose the one that suits you best.

Ultra-thin patented graphene heat-sink makes installations painless
The patented ultra-thin heat-sink is made from the optimal heat conductive material—graphene, offering painless, interference-free installations on gaming PCs, gaming, laptops, and PS5 consoles.

Optimized performance operation that balances reliability and lifetime
Windows TRIM SSD Optimization makes sure Free Block is made into use upon being released to speed up transmission and write performances. The wear-leveling technology and ECC enhance data transmission reliability while prolonging SSD lifetime.

Smart product status monitoring system
TEAMGROUP’s patented S.M.A.R.T. monitoring software tracks SSD status at all times and conducts fast and simple settings and inspections to monitor the SSD’s quality status and performance.

An environmental protector
The entire production is lead-free and halogen-free, RoHS-compliant, and adopts recyclable environmentally friendly materials for packaging to conserve Earth by being eco-friendly.
Hard drive
PCI Express interface data lanesx4
SSD capacity512 GB
Memory type3D NAND
Performance
Windows operating systems supportedWindows Vista, Windows 7, Windows 8, Windows 8.1, Windows 10, Windows 11
Mac operating systems supportedYes
Linux operating systems supportedKernel 2.6.33, Yes
InterfacePCI Express 4.0
Component forUniversal
NVMeYes
Low-density parity-check (LDPC)Yes
TBW rating325
PCI Express interface data lanesx4
SSD capacity512 GB
S.M.A.R.T. supportYes
TRIM supportYes
Memory type3D NAND
Mean time between failures (MTBF)300000 h
Endurance
Mean time between failures (MTBF)300000 h
Features
InterfacePCI Express 4.0
Component forUniversal
NVMeYes
Low-density parity-check (LDPC)Yes
TBW rating325
PCI Express interface data lanesx4
SSD capacity512 GB
Windows operating systems supportedWindows Vista, Windows 7, Windows 8, Windows 8.1, Windows 10, Windows 11
S.M.A.R.T. supportYes
TRIM supportYes
Mac operating systems supportedYes
Linux operating systems supportedKernel 2.6.33, Yes
Memory type3D NAND
Mean time between failures (MTBF)300000 h
SSD form factorM.2
M.2 SSD size2280 (22 x 80 mm)
Power
Operating voltage3.3 V
Design
Component forUniversal
Cooling typeHeatsink
Product colourBlack
SSD form factorM.2
Weight & dimensions
Width22 mm
Weight7 g
Height3.7 mm
Depth80 mm
System requirements
Windows operating systems supportedWindows Vista, Windows 7, Windows 8, Windows 8.1, Windows 10, Windows 11
Mac operating systems supportedYes
Linux operating systems supportedKernel 2.6.33, Yes
Operational conditions
Operating temperature (T-T)0 - 70 °C
Storage temperature (T-T)-40 - 85 °C
Non-operating shock1500 G
Operating vibration20 G
Technical details
InterfacePCI Express 4.0
S.M.A.R.T. supportYes
Operating temperature (T-T)0 - 70 °C
TRIM supportYes
Storage temperature (T-T)-40 - 85 °C
Non-operating shock1500 G
Operating vibration20 G
Product colourBlack
SSD form factorM.2
Warranty period5 year(s)
Compliance certificatesFederal Communications Commission (FCC), CE, UKCA, EAC, RoHS
Doesn't containLead, Mercury, Cadmium
Sequential read/writeYes
Sequential writing speed2500 MB/s
Sequential reading5000 MB/s
Certificates
Waste Electrical and Electronic Equipment (WEEE) complianceYes
Software
Windows operating systems supportedWindows Vista, Windows 7, Windows 8, Windows 8.1, Windows 10, Windows 11
Mac operating systems supportedYes
Linux operating systems supportedKernel 2.6.33, Yes
Certification
Waste Electrical and Electronic Equipment (WEEE) complianceYes
Other features
Cooling typeHeatsink
Product colourBlack
Sequential read/writeYes
Sequential writing speed2500 MB/s
Sequential reading5000 MB/s
Warranty period5 year(s)
Compliance certificatesFederal Communications Commission (FCC), CE, UKCA, EAC, RoHS

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SKU
TM8FFE512G0C129
SA400S37/480G
TM8PS7512G0C101
TM8PS7256G0C101
TM8FP6512G0C101
TM8FP6256G0C101
Manufacturer
Team Group
Kingston Technology
Team Group
Team Group
Team Group
Team Group
Component for
Universal
PC/notebook
PC/notebook
PC/notebook
PC/notebook
PC/notebook
SSD capacity
500GB to 800GB
400GB to 500GB
500GB to 800GB
250GB to 300GB
500GB to 800GB
250GB to 300GB
SSD form factor
M.2
2.5"
M.2
M.2
M.2
M.2
Interface
PCI Express 4.0
Serial ATA III
N/A
N/A
PCI Express 3.0
PCI Express 3.0
Memory type
3D NAND
TLC
N/A
N/A
3D NAND
3D NAND